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Chipbond and Taiwan team reached strategic cooperation agreement for IGBT project
Chipbond and Taiwan team reached strategic cooperation agreement for IGBT project
On August 9, 2019, Shenzhen Chipbond Technology and Taiwan's IGBT project team formally signed an investment agreement, which will establish Chipbond Holding's subsidiary to enter the IGBT field! The Taiwan IGBT project team has rich R & D experience in the industry, and masters the innovative technology of IGBT products. I believe that the explosion of new products in the future is just around the corner!
On August 9, 2019, Shenzhen Chipbond Technology and Taiwan's IGBT project team formally signed an investment agreement, which will establish Chipbond Holding's subsidiary to enter the IGBT field! The Taiwan IGBT project team has rich R & D experience in the industry, and masters the innovative technology of IGBT products. I believe that the explosion of new products in the future is just around the corner!
Vice Mayor Wang Lixin inspects XIBANG
Vice Mayor Wang Lixin inspects XIBANG
Time of issue : 2019-11-20 14:40:00
On August 6, 2019, Deputy Mayor Wang Lixin and his party went to Pingshan District to inspect the development status of key integrated circuit enterprises. As a key enterprise in Pingshan District, Shenzhen Xinbang Technology has received the attention of Deputy Mayor Wang Lixin. Liu Shanglin, General Manager of Touch Division of Xinbang Technology, introduced the company's situation and the development progress of new products to Deputy Mayor Wang Lixin.
On August 6, 2019, Deputy Mayor Wang Lixin and his party went to Pingshan District to inspect the development status of key integrated circuit enterprises. As a key enterprise in Pingshan District, Shenzhen Xinbang Technology has received the attention of Deputy Mayor Wang Lixin. Liu Shanglin, General Manager of Touch Division of Xinbang Technology, introduced the company's situation and the development progress of new products to Deputy Mayor Wang Lixin.
Chipbond won the "Best Development Potential" award
Chipbond won the "Best Development Potential" award
Time of issue : 2019-11-20 14:39:00
On February 22, 2019, the Shenzhen Semiconductor Industry Summary Conference was grandly held at the Kempinski Hotel. Shenzhen Chipbond Technology won the "Best Development Potential" award for its new product fingerprint control chip. Chipbo Technology's general manager Li Huawei attended the meeting and took the stage to receive the award. In 2018, Shenzhen Xinbang Technology developed a fingerprint control chip for consumer fingerprint applications. It supports a variety of external fingerprint sensors. There are few external components on the pcb. Market competitiveness, the product will be officially put on the market in 19 years.
On February 22, 2019, the Shenzhen Semiconductor Industry Summary Conference was grandly held at the Kempinski Hotel. Shenzhen Chipbond Technology won the "Best Development Potential" award for its new product fingerprint control chip. Chipbo Technology's general manager Li Huawei attended the meeting and took the stage to receive the award. In 2018, Shenzhen Xinbang Technology developed a fingerprint control chip for consumer fingerprint applications. It supports a variety of external fingerprint sensors. There are few external components on the pcb. Market competitiveness, the product will be officially put on the market in 19 years.
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