Chipbond and Taiwan team reached strategic cooperation agreement for IGBT project

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Chipbond and Taiwan team reached strategic cooperation agreement for IGBT project

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2019 Nian 8 Yue 9 , the Shenzhen core state science and technology with Taiwan IGBT project team officially signed an investment agreement to set up a subsidiary of core state into the IGBT field!

The Taiwan IGBT project team has rich R & D experience in the industry, and masters the innovative technology of IGBT products. I believe that the explosion of new products in the future is just around the corner!

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Shenzhen simbond Technology Co., Ltd

Address: room 701 and 702, building 12, Shenzhen Software Park Phase II, Keji Zhonger Road, Nanshan District, Shenzhen

Tel：0755-88835998

Fax：0755-86338595

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