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Chipbond won the "Best Development Potential" award

Chipbond won the "Best Development Potential" award

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     On February 22, 2019, the Shenzhen Semiconductor Industry Summary Conference was grandly held at the Kempinski Hotel. Shenzhen Chipbond Technology won the "Best Development Potential" award for its new product fingerprint control chip. Chipbo Technology's general manager Li Huawei attended the meeting and took the stage to receive the award.

 

     In 2018, Shenzhen Xinbang Technology developed a fingerprint control chip for consumer fingerprint applications. It supports a variety of external fingerprint sensors. There are few external components on the pcb, and it has the advantages of zero standby power consumption, ultra-low cost and other advantages. Market competitiveness, the product will be officially put on the market in 19 years.

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Shenzhen simbond Technology Co., Ltd

Address: room 701 and 702, building 12, Shenzhen Software Park Phase II, Keji Zhonger Road, Nanshan District, Shenzhen

Fax:0755-86338595

Zip:518057

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