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Chipbond successfully listed on the new third board

Chipbond successfully listed on the new third board

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     On the morning of August 1, 2014 , the listing ceremony of the new third board of Chipbond Technology Co., Ltd. ( stock code: 830845 Chipbond Technology) was grandly held in Jinyang Building, National Small and Medium-sized Enterprise Share Transfer System Company, No. 26, Financial Street, Beijing. , President Zhang Hualong participated in the listing ceremony and performed the bell on behalf of the company.

Through its listing on the New Third Board, Chipbond Technologies has improved corporate governance and consolidated its management foundation to achieve standardized development of the company. The successful listing of Chipbond Technology is conducive to the company's use of the capital market to obtain long-term and stable development funds, in order to expand the company's size, increase research and development investment, increase the company's core competitiveness, and at the same time effectively increase Chipbond's brand value and market influence.

       The successful listing of Chipbond Technology is a milestone and an opportunity for the company's development. The company will use this as a starting point and continue to adhere to the corporate vision of “BodyChip with Chips and People”, carry forward the pioneering and innovative spirit, and strive for better quality. Products return to customers and society.

Shenzhen simbond Technology Co., Ltd

Address: room 701 and 702, building 12, Shenzhen Software Park Phase II, Keji Zhonger Road, Nanshan District, Shenzhen

Fax:0755-86338595

Zip:518057

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